Suitable for cutting, grinding and polishing of organic and inorganic brittle materials. Such as: wire saws, stone, and cutting tools, saw blades, semiconductor saw blade, also applicable to monocrystalline silicon, polycrystalline silicon, diamond, ruby, sapphire, quartz plate, LED sapphire substrates, liquid crystal glass, with high precision magnetic materials, semiconductor and other high-tech materials coarse grinding, fine grinding and polishing tools