Specifications: DLM-W4.0μm - DLM-W 60μm
 Features: DLM-W is produced by special processing using high purity and high strength MBD diamond as raw material. This product has characteristics of regular crystal shape, narrow particle size distribution, and narrow effective cutting/grinding particles size distribution. The product possesses high intensity, low impurity content, good abrasion resistance, and good dispersibility as well.
Application Fields:It’s suitable for diamond wire saw for cutting and grinding single crystal silicon wafer, poly crystal silicon wafer, sapphire wafer, high precision magnetic material, jewelry jade material and high precision ceramic material. It is also suitable for rough grinding and fine grinding of sapphire, quartz, liquid crystal glass, high-precision magnetic materials, jewelry and jade materials and high-precision ceramics.