Using MBD series diamond with high technology and high strength as raw material, and the product is processed with precision production. The product has regular crystal shape, concentrated particle size distribution, high particle strength, very low impurity content, and excellent dispersion and wear resistance.
Suitable for cutting, grinding and polishing of organic and inorganic brittle materials. Such as: wire saw, gem saw blade, semiconductor cutting tools, also suitable for monocrystalline silicon, polysilicon, diamond, gem, sapphire, quartz, LED sapphire substrate, liquid crystal glass, high precision magnetic materials, semiconductor and other high-tech materials rough grinding, fine grinding, polishing tools.